Cadence Collaborates with Arm to Accelerate Mobile Device Silicon Success with New Arm Total Compute Solutions
The Californer/10242005

SAN JOSE, Calif. ~ Cadence Design Systems, Inc. (Nasdaq: CDNS) has announced that it is continuing to expand its collaboration with Arm to advance mobile device silicon success. The collaboration will provide customers with a faster path to tapeout through the use of Cadence digital and verification tools and the new Arm Total Compute Solutions 2023 (TCS23).

The Cadence digital flow for Arm TCS23 includes Rapid Adoption Kits (RAKs) for 3nm and 5nm nodes. These RAKs are designed to help customers achieve power and performance goals using the new Arm TCS23. The Cadence tools optimized for the new Arm TCS23 include Cerebrus Intelligent Chip Explorer, Genus Synthesis Solution, Modus DFT Software Solution, Innovus Implementation System, Quantus Extraction Solution, Tempus Timing Signoff Solution and ECO Option, Voltus IC Power Integrity Solution, Conformal Equivalence Checking and Conformal Low Power.

Cerebrus provides Arm with AI-driven design optimization capabilities that resulted in 50% better timing (TNS), a 10% reduction in cell area and 27% improved leakage power on the Cortex-X4 CPU. This enables Arm to achieve power, performance and area (PPA) targets faster. The digital RAKs also provide customers with improved productivity versus a manual, iterative approach as well as an integrated implementation flow that offers improved predictability and PPA which leads to faster design closure.

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The Cadence verification flow was used by Arm to validate the Cortex-X4, Cortex-A720 and Cortex-A520 CPU-based and Immortalis-G720, Mali-G720 and Mali-G620 GPU-based mobile reference platforms. This verification flow supports Arm TCS23 and includes Xcelium Logic Simulation Platform, Palladium Z1 and Z2 Enterprise Emulation Platforms, Helium Virtual and Hybrid Studio, Jasper Formal Verification Platform and Verisium Manager Planning and Coverage Closure tools. It also enables users to improve overall verification throughput as well as leverage advanced software debug capabilities.

Chris Bergey, senior vice president and general manager of Client Line of Business at Arm said "With the delivery of Arm TCS23 we're unlocking the creative potential for customers around the world who demand high performance and efficient compute for next-generation mobile experiences" He added "Through our ongoing collaboration with Cadence we successfully leveraged the Cadence digital and verification flows to get our latest generation of CPUs and GPUs into our customers' hands faster"

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Dr Chin Chi Teng senior vice president & general manager of Digital & Signoff Group at Cadence said "Arm is known for building foundational computing platforms that address performance & efficient compute requirements & the new arm TCS23 is aimed at empowering designers to create world's most advanced mobile designs that provide best user experience" He further added "By collaborating with arm on development of TCS23 & by delivering innovative digital & verification flows we're jointly leading our customers to improve overall productivity & achieve faster time to tapeout"

The collaboration between Cadence Design Systems Inc & ARM is aimed at providing customers with a faster path to tapeout through use of their digital & verification tools along with new ARM Total Compute Solutions 2023 (TCS 23). This will enable them to achieve power & performance goals while also improving overall productivity & achieving faster time to tapeout.
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