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Casey Krawiec, Vice President of Global Sales at StratEdge, explained that the success of a package's performance depends on the base material, the quality of package construction, and the attachment process. He further elaborated that their presentation offered valuable insights through comparisons utilizing simulation data to highlight avenues for enhancement and impact to chip-to-package junction temperatures.
InterPACK is the primary annual technical conference of the Electronics and Photonics Packaging Division (EPPD) of the ASME. It served as an enriching platform for the exchange of state-of-the-art knowledge encompassing research, development, manufacturing, and applications in packaging. StratEdge sponsored this year's conference and showcased their groundbreaking findings.
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For further information or to schedule a meeting with StratEdge Corporation please reach out via email at email@example.com or visit their website www.stratedge.com. A photo is available at https://www.stratedge.com/interpack2023-strated...
At InterPACK 2023 in San Diego this October, StratEdge Corporation presented their latest findings on crucial aspects of packaging materials and assembly methodologies significant to Gallium Nitride (GaN) devices. Casey Krawiec, Vice President of Global Sales at StratEdge explained that success hinges upon base material quality as well as package construction and attachment process optimization; offering valuable insights through simulation data comparisons to highlight avenues for enhancement and impact chip-to-package junction temperatures. The conference was sponsored by StratEdge who showcased their groundbreaking findings; further information can be found by reaching out via email or visiting their website with a photo available online.
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