Silicon Box Ships 500M Units at High Yield, Expands Production Capacity for Panel-Level Packaging
The Californer/10353883

TAMPINES, Singapore - Californer -- Silicon Box, a global leader in chiplet integration and advanced semiconductor packaging, has shipped 500 million units from its flagship Singapore factory, a fivefold increase since October last year, while maintaining industry-beating yield. The facility, on the island state's Tampines Wafer Park, is expanding production capacity to meet rising global demand for advanced packaging and chiplet technology.

"As a growing company, I am incredibly proud of our team's ongoing success in demonstrating manufacturing excellence and efficiency in mass production, while enabling cutting-edge performance requirements for our customers," said Jae Hak "JH" Yee, chief operations officer at Silicon Box. "We are now focused on ramping up our production capacity by a factor of ten within 2026, while exceeding our existing customer commitments for 2026. We are expected to hit the 1.5-billion-unit shipment milestone in early Q4."

Silicon Box addresses performance, scalability and cost challenges in wafer-level and monolithic chip architectures by enabling chiplet-based semiconductors on a large panel-level manufacturing scheme. The company is the only advanced packaging provider producing exclusively at panel-scale with commercially viable yields.

Silicon Box at the Cutting Edge

As the semiconductor industry coalesces its focus on key technology trends, Silicon Box sits at the cross section of some of the most promising ones for back-end chip manufacturing, including panel-level packaging and chiplet integration via advanced packaging. Once enabled, these innovations have the potential to disrupt legacy packaging approaches through foundational improvements to manufacturing efficiency and chip system performance. At the same time, they have the potential to solve rising challenges in cost, scale, performance and sustainability currently impeding the rapid deployment of future tech, in no small part, due to hardware constraints.

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Early customers across a broad range of device applications from multi-chip AI training products to simple devices requiring fast production ramp up and massive scale are already taking advantage of Silicon Box's technology, proving the long-conjectured value propositions associated with panel-level packaging and a chiplet approach to chip system design.

"Customers are recognizing the benefits of chiplet architectures and panel-scale production, especially with the unprecedented demands for chip performance and on supply being driven by the AI boom. Ramping high-yield production at scale while achieving strict performance, power and reliability requirements are all critical," added Mike Han, chief revenue officer at Silicon Box. "We are seeing strong growth across all our customer verticals, while demand for R&D collaboration in AI and robotics applications is skyrocketing."

Fresh Funding and Capacity Expansion

Silicon Box marks its fifth year with continued support from institutions, investors, and industry partners. The company recently raised a USD 75 million debt facility and closed an extension of its Series B round with USD 156.5 million, bringing the company's valuation to over USD 1.7 billion. Well positioned for its next phase of growth, Silicon Box plans to continue investing in capacity, technology and talent to deliver capabilities and manufacturing scale needed to support frontier applications.

The Singapore factory is currently undergoing a USD 300 million expansion to support rising demand from customers in mass production. Meanwhile, the company's planned site in Novara, Piedmont, Italy, representing a EUR 3.2 billion total investment, is supported by a EUR 1.3 billion grant from the European Commission, through the EU Chips Act. This March, the project was granted Open EU Foundry status, confirming both Europe and Silicon Box's ongoing progress and commitment to the project.

About Silicon Box

Silicon Box is an advanced semiconductor packaging company, specializing in cutting-edge integration technology and manufacturing processes. We offer solutions that enable chiplet architecture, as well as high-performance, affordable alternatives to traditional packaging schemes. Leveraging our proprietary technology, 30 years of multi-sectoral expertise, and relationships with best-in-class partners, we strive to solve the unique challenges of chiplet adoption to build the emergent technologies shaping the world around us today. Silicon Box was founded in 2021 by Dr. Byung Joon (BJ) Han, Dr. Sehat Sutardja, and Weili Dai. To learn more about Silicon Box, visit: silicon-box.com/newsroom and silicon-box.com/timeline

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Forward-Looking Statements

This report contains forward-looking statements that involve a number of risks and uncertainties. Such statements include: our manufacturing expansion and investment plans and expectations in the European Union (EU) and the anticipated benefits therefrom; anticipated supplier, ecosystem, community, and government support and approval for our planned EU investments and anticipated benefits related to such support; environmental plans for and benefits from our factories and technologies; and other characterizations of future plans, expectations, events, or circumstances. Such statements involve risks and uncertainties that could cause our actual results to  differ materially from those expressed or implied, including: changes in demand for our  products; Silicon Box's failure to realize the anticipated benefits of its strategy, plans, and  proposed transactions; construction delays or changes in plans due to business,  economic, or other factors; increases in capital requirements and changes in capital  investment plans; adverse changes in anticipated government incentives and associated  approval related to Silicon Box's planned EU investments; adverse legislative or other  government actions; insufficient ecosystem support; the impact of macroeconomic and  geopolitical trends and events; and other risks and uncertainties described in this press  release. All information in this press release reflects management's views as of the date hereof unless an earlier date is specified. We do not undertake, and expressly disclaim any duty, to update such statements, whether as a result of new information, new developments, or otherwise, except to the extent that disclosure may be required by law.